electronic thermal conductivity
英 [ɪˌlekˈtrɒnɪk ˈθɜːml ˌkɒndʌkˈtɪvəti]
美 [ɪˌlekˈtrɑːnɪk ˈθɜːrml ˌkɑːndʌkˈtɪvəti]
【电】电子热传导
双语例句
- Experimental Study on Indirect Thermosyphon Radiator Coupled with Flat Heat Pipe for Electronic Component Thermal Conductivity of the Carbon Nanotube/ Silicone Grease Composite
电子器件用复合热管散热器的试验研究碳纳米管/导热硅脂复合材料的导热性能 - The core-shell Cu-Ag coated powder has a wide application in electronic slurry, conductive filler and other fields because of its good oxidation resistance, thermal stability and high conductivity.
由于其良好的抗氧化性、热稳定性及高电导性，核壳结构铜-银包覆粉在电子浆料、导电填料等众多领域具有广阔的应用前景。 - Traditional epoxy packaging materials are required for higher performance with the micro electronic packaging density increasing. Composites with high thermal conductivity can be fabricated by addition of ceramic particles or fiber into polymers, and can be used as electronic packaging materials.
微电子封装密度的提高对传统环氧塑封料的导热性能提出了更高的要求，将高导热的陶瓷颗粒/纤维材料添加到聚合物塑封材料中可获得导热性能好的复合型电子封装材料。 - Metal Matrix composites ( MMC) have received substantial attention as Electronic Packaging Material, because of theirs properties: high thermal conductivity and low coefficient of thermal expansion.
金属基复合材料作为电子封装材料，具有高导热、低膨胀的特点。 - The electronic contribution to the thermal conductivity can be deduced from the electrical conductivity through the use of the Wiedemann-Franz law. However, the thermal conductivity due to phonon heat transfer cannot be measured directly.
自由电子引起的热导率可以通过电导率，利用Wiedemann-Franz定律得到，声子引起的热导率目前仍然不能进行实验测量，只能借助其他方法来研究。 - The types of electronic packaging are introduced and the current state and tendency of packaging technologies an materials are reviewed in this paper. The emphasis, is placed on the metallization of high thermal conductivity AIN ceramics substrates and AIN-W co-fired multilayer substrates.
本文介绍了电子封装的各种类型，综述了电子封装技术与封装材料的现状及发展趋势，重点讨论了高热导AIN基片金属化及AIN－W多层共烧工艺。 - Aluminum nitride ( AIN) substrate has been recognized as one of ihe most promising electronic substrate as heating panel and packaging materials for its high thermal conductivity, fine electrical insulation, and close coefficient of thermal expansion to silicon semiconductor.
氮化铝材料具有较高的热导率和良好的介电性能，机械强度高，热膨胀系数与半导体硅材料相近，非常适于制造大功率或快速半导体器件的散热基片和封装材料。 - Recently, it was found that the composite with high volume fraction of SiC particulate could be used in semiconductor and electronic industry due to its high thermal conductivity and low thermal expansion coefficient.
最近，高体积分数的SiC颗粒增强铝基复合材料还由于其高热导率和低热膨胀系数等特性在半导体和电子行业有了新的应用前景。 - Copper alloys are widely applied in electrical and electronic industries, because of their excellent electric conductivity, thermal conductivity and machining properties.
铜合金因其具有优良的导电、导热以及机械性能，在电工电子等行业得到了广泛的应用。 - Compared with traditional electronic packaging materials, diamond/ copper composites have higher thermal conductivity, lower relative density, thermal expansion coefficient matching with semiconductor materials, etc., which has gained extensive attention as a new generation of electronic packaging materials.
金刚石/铜复合材料由于具有热导率高、密度低、热膨胀系数与半导体材料相匹配等优点，已经成为广受重视的新一代电子封装材料之一。 - SiC has wide application in the field of high temperature, high frequency, high power and radioresistance because of its excellent physics and electronic characteristics, such as wide band gap, high breakdown electrical field and high thermal conductivity.
碳化硅（SiC）由于具有宽禁带、高击穿场强、高热导率等优异的物理及电子学特性，使其在高温、高频、大功率及抗辐射等领域具有广阔的应用前景。 - W-Cu alloy is a good composite materials for electronic packaging, it combine the low-expansion performance of tungsten and the high thermal conductivity properties of copper, so it has an excellent thermal conductivity and adjustable thermal expansion coefficient.
钨铜合金结合了钨的低膨胀性和铜的高热导性能，是一种具有优良的导热性能和可调节的热膨胀系数的电子封装复合材料。 - Magnesium alloys are widely used in the fields of automobile, electronic and aviation. Magnesium alloys possess many advantages, such as high specific strength, excellent damping capacity, better thermal conductivity, and good machinability.
镁合金具有高的比强度、比刚度、良好的减振性、导热性和可切削加工性，广泛地应用于汽车、电子、航空航天等领域。 - Particle-filled thermal interface materials which are widely used in electronic devices packaging, have the advantages of high thermal conductivity, low cost, easy to operate, etc., and they can effectively reduce the interfacial thermal resistance in thermal management of packaging.
广泛使用的粒子填充型热界面材料，具有高热导率、低成本、易操作等优点，可以有效降低封装散热中的界面热阻。 - To meet the demands of the new generation of electronic information industry, these materials must have outstanding integrated performance including good processing characteristics, high mechanical properties, outstanding heat resistance, high thermal conductivity, favorable electric insulation and low thermal expansion.
在确保材料具备优良的工艺性和力学性能的同时，还必须具有高耐热、高导热、高电绝缘和低膨胀率等性能，以满足电子信息行业的要求。 - With the development of electronic, mechanical, aeronautic and aerospace industries, requires imperative demand of developing functional materials with not only high electrical conductivity, thermal conductivity, and excellent mechanical properties, wear-resistant, low coefficient of thermal expansion.
随着机械、电子以及航空航天工业的迅猛发展，迫切要求开发不仅具有良好导电（热）性、而且具有较高机械和耐磨性能，较低热膨胀系数的功能材料。 - Silicon carbide ( SiC) is a promising candidate for applications in high temperature, high voltage, high power electronic devices because of its outstanding properties such as wide band gap, high critical electric field and high thermal conductivity.
SiC半导体由于具有禁带宽度大、临界击穿电场和热导率高等特点，在高温、高压、大功率器件领域具有广阔的应用前景。 - Metal matrix composites ( MMCs) have been of interest in electronic packaging technology due to their good thermal properties, mainly the high thermal conductivity and low coefficient of thermal expansion.
金属基复合材料（MMCs）可以把基体的高热传导性与增强体的低热膨胀系数结合起来，具有良好的综合热物理性能，满足对电子封装材料性能的要求。 - Diamond/ copper composite material compared with traditional electronic packaging materials, which had low coefficient of thermal expansion and high thermal conductivity, besides, the coefficient of thermal expansion matches well of Si and GaAs.
金刚石/铜复合材料与传统电子封装材料相比具有低的热膨胀系数和高的热导率，同时与Si、GaAs的热膨胀系数相匹配。 - Silicon carbide ( SiC) is the third generation semiconductor material. It will be widely used on high-temperature, high-frequency and high-power electronic devices because of its wide bandgap, high physicochemical stability and high thermal conductivity.
SiC是第三代半导体材料，由于其禁带宽度大、热传导率高、热稳定性好，在高温、高频、大功率电子器件领域将会得到广泛的应用。